![Advanced Materials and Components for 5G and Beyond](/uploads/posts/2022-11/1668966420_5881_advanc_d_mat_rials_and_compon_nts_for_5g_and_b_yond.jpg)
Автор: Colin Tong
Издательство: Springer
Год: 2022
Страниц: 276
Язык: английский
Формат: pdf (true)
Размер: 15.6 MB
This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices.